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Wirtschaftliche Aspekte bei laermarmen Kraftfahrzeugen. Investitions- und Betriebskostenanalyse
Werkstoffuntersuchungen an Faltenbaelgen fuer Gleichlaufgelenke
Vergleich und Bewertung einer rahmenfesten und einer motornahen Kapsel für Verteiler-LKW
Variable emissivity through MEMS technology
Trends und Zukunftsperspektiven bei der Laermminderung an Kraftfahrzeugen
TPE-Glasumspritzung von Fahrzeugen, TPE-glass encapsulation
Totally enclosed heat pipe cooled induction motor (theoretical and experimental results)
Thesound reduction index applied to automotive problems
Thermal management of military fighter aircraft electro-optics pod: an invited paper
Thermal management for high performance computing in spaceborne applications
Thermal characterization of a mercury arc lamp for a projection display system
Test method for availability of holes in height - temperature barrier on cementation process
Technologien zur funktionellen Integration von Akustik, Aerodynamik und Wärmemanagement
Submarine telecommunications systems, int. Conf.; Febr. 26-29, 1980, London, GB (Part.3)
Some aspects concerning noise reduction on diesel passenger cars
Some aspects concerning noise reduction of passenger cars with diesel and gasoline engines
Schnittstellenprobleme zwischen Aggregat und Karosserie bei Leichtbaukonzepten
Research project for reducing the noise of truck Diesel engines
Reduktion der Kältemittelfüllmenge im Pkw durch den Einsatz von kompakten Kältemittelkreisläufen
Reduction in size and weight of electronic modules through the evolution of packaging design
Performance of new silicone adhesives and encapsulants at high and low temperatures
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
Optimierung eines Fahrzeugkühlsystems für instationären Betrieb
On the isolation of science payloads from spacecraft vibrations
Novel composites for space microelectronics and optics
Novel component packaging for high current applications using power semiconductor devices
Non-hermetic embedded MCM technologies for automotive and other lower cost applications
New techniques and thermoplastics for encapsulating automotive sensors and solenoids
New method for electrothermal simulations: HDTMOS in automotive applications
NASA Lewis advanced individual pressure vessel (IPV) nickel/hydrogen technology
Multilayer alumina substrates for ECU (automotive electronics)