New fields of high power inverter systems such like hybrid cars, hybrid trucks, and off road vehicles require new ways of power electronics integration and packaging. The stringent requirements in size and weight, reliability, durability, ambient temperature, and environment can be fulfilled by a careful consideration of IGBT and diode chip selection, novel packaging technologies and consequent integration of passive components. In this paper the authors will discuss how the environmental conditions of automotive applications drive silicon power device selection and packaging technologies. Extreme cooling conditions require a package design that needs to work on the thermal and electrical limits of the components without making any compromise in reliability and durability. A high power Integrated Inverter Module (MM) for 600 V, 150 kVA, integrating all necessary system components in a single package, has been realized.
Packaging considerations of an integrated inverter module (IIM) for hybrid vehicles
2005
6 Seiten, 12 Bilder, 4 Quellen
Conference paper
English
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