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    Title :

    Flip chip solder bump inspection using vibration analysis


    Contributors:
    Liu, J. (author) / Shi, T. (author) / Xia, Q. (author) / Liao, G. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 18 , 3 ; 303-309


    Publication date :

    2012-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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