A plated solder-bump process used for the manufacture of high-reliability flip chips is described. Characterization work done to improve the process manufacturability and the resulting product reliability gains are reviewed. Two detailed studies of the thin-film deposition conditions and the Cu pedestal plating parameters are described. Recommendations implemented as a result of these studies have reduced the bump-interconnect-failure level from a defect rate of approximately 500 p.p.m. to <10 p.p.m. Excellent temperature cycling performance of assembled hybrids was obtained. The process has been used in high-volume production to manufacture ICs used in automobiles (under-hood application). In process capability has improved from a Cp<1 to Cp>1.5. This work highlights the need and the benefits of detailed characterization, which results in more robust manufacturing processes and eventually in more reliable product performance.


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    Title :

    Reliability improvements in solder bump processing for flip chips


    Additional title:

    Zuverlässigkeitsverbesserung beim Bump-Löten für Flip-Chips


    Contributors:
    Warrior, M. (author)


    Publication date :

    1990


    Size :

    10 Seiten, 11 Quellen


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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