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    Title :

    Flip-chip assembly and reliability using gold/tin solder bumps [5454-03]



    Conference:

    Technical conference, Micro-optics : fabrication, packaging, and integration ; 2004 ; Strasbourg, France



    Publication date :

    2004-01-01


    Size :

    10 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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