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    Title :

    Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications


    Contributors:
    Yoon, J. W. (author) / Chun, H. S. (author) / Koo, J. M. (author) / Jung, S. B. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 13 , 11-12 ; 1463-1469


    Publication date :

    2007-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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