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    Title :

    Self-aligned Assembly Technology for Laser Diode Modules using Stripe-type AuSn Solder Bump Flip-chip Bonding



    Conference:

    8th Annual meeting, LEOS '95 ; 1995 ; San Francisco; CA


    Published in:

    LEOS '95 ; 234-235


    Publication date :

    1995-01-01


    Size :

    2 pages


    Remarks:

    IEEE Cat no 95CH35739



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English







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