The AuSn solder process is applied to optoelectronic modules using a high accuracy flip-chip bonder (Karl Suss FC150). The different requirements of the modules are matched by adjusting the metallization layers of the bond pads, the solder deposition and the bonding parameters, i.e. temperature, bond-force and hold-time.


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    Title :

    Application of flip-chip-bonders in AuSn solder processes to achieve high after bonding accuracy for optoelectronic modules


    Contributors:
    Elger, G. (author) / Voigt, J. (author) / Oppermann, H. (author)


    Publication date :

    2001-01-01


    Size :

    221081 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English





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