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    Title :

    Development of an assembly process and reliability investigations for flip-chip LEDs using the AuSn soldering


    Contributors:
    Elger, G. (author) / Hutter, M. (author) / Oppermann, H. (author) / Aschenbrenner, R. (author) / Reichl, H. (author) / Jager, E. (author)

    Published in:

    Publication date :

    2002-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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