Self-aligned Assembly Technology for Laser Diode Modules using Stripe-type AuSn Solder Bump Flip-chip Bonding
8th Annual meeting, LEOS '95 ; 1995 ; San Francisco; CA
01.01.1995
2 pages
IEEE Cat no 95CH35739
Aufsatz (Konferenz)
Englisch
LEOS , lasers , IEEE , electro-optics
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