WE3 Application of Flip-Chip-Bonders in AuSn Solder Processes to Achieve High after Bonding Accuracy for Optoelectronic Modules
Annual meeting; 14th, IEEE; Lasers and Electro-Optics Society ; 2001 ; San Diego, CA
01.01.2001
2 pages
IEEE cat no 01CH37242
Aufsatz (Konferenz)
Englisch
LEOS , lasers , IEEE , electro-optics
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