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    Titel :

    WE3 Application of Flip-Chip-Bonders in AuSn Solder Processes to Achieve High after Bonding Accuracy for Optoelectronic Modules


    Beteiligte:

    Kongress:

    Annual meeting; 14th, IEEE; Lasers and Electro-Optics Society ; 2001 ; San Diego, CA



    Erscheinungsdatum :

    01.01.2001


    Format / Umfang :

    2 pages


    Anmerkungen:

    IEEE cat no 01CH37242




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





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