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    Title :

    Multiwavelength DFB-LD array module using self-aligned solder bump bonding



    Conference:

    International conference; 11th, Integrated optics and optical fibre communications: IOOC-ECOC97 ; 1997 ; Edinburgh



    Publication date :

    1997-01-01


    Size :

    4 pages


    Remarks:

    Held in conjunction with the 23rd European conference on optical communications




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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