Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    A High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology


    Contributors:
    Jackson, K. P. (author) / Flint, E. B. (author) / Cina, M. F. (author) / Lacey, D. (author)

    Published in:

    Publication date :

    1994-01-01


    Size :

    1185 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    621.3692



    Flip chip solder bump inspection using vibration analysis

    Liu, J. / Shi, T. / Xia, Q. et al. | British Library Online Contents | 2012


    Au–Sn flip-chip solder bump for microelectronic and optoelectronic applications

    Yoon, J. W. / Chun, H. S. / Koo, J. M. et al. | British Library Online Contents | 2007



    Self-aligned Assembly Technology for Laser Diode Modules using Stripe-type AuSn Solder Bump Flip-chip Bonding

    IEEE / Lasers and Electro-Optics Society | British Library Conference Proceedings | 1995


    Low-Loss, Self-Aligned Flip-Chip Technique for Interchip and Fiber Array to Waveguide OEIC Packaging

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1994