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    Title :

    A High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology


    Contributors:
    Jackson, K. P. (author) / Flint, E. B. (author) / Cina, M. F. (author) / Lacey, D. (author)

    Published in:

    Publication date :

    1994-01-01


    Size :

    1185 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    Unknown


    Classification :

    DDC:    621.3692




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