A High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology
JOURNAL OF LIGHTWAVE TECHNOLOGY LT ; 12 , 7 ; 1185
1994-01-01
1185 pages
Article (Journal)
Unknown
DDC: | 621.3692 |
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