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    Title :

    Low-Loss, Self-Aligned Flip-Chip Technique for Interchip and Fiber Array to Waveguide OEIC Packaging



    Conference:

    7th Annual meeting, LEOS '94 ; 1994 ; Boston; MA


    Published in:

    LEOS '94 ; 269-270


    Publication date :

    1994-01-01


    Size :

    2 pages


    Remarks:

    In 2 vols; IEEE Cat no 94CH3371-2



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English







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