Alignment-free laser diode module assembly technology has been developed. The laser diode is self-aligned to a single-mode optical fiber (SMF) by using stripe-type AuSn solder bumps. Alignment error of /spl plusmn/1 /spl mu/m has been achieved.


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    Title :

    Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding


    Contributors:
    Sasaki, J. (author) / Honmou, H. (author) / Itoh, M. (author) / Uda, A. (author) / Torikai, T. (author)


    Publication date :

    1995-01-01


    Size :

    258847 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Self-aligned Assembly Technology for Laser Diode Modules using Stripe-type AuSn Solder Bump Flip-chip Bonding

    IEEE / Lasers and Electro-Optics Society | British Library Conference Proceedings | 1995




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