Alignment-free laser diode module assembly technology has been developed. The laser diode is self-aligned to a single-mode optical fiber (SMF) by using stripe-type AuSn solder bumps. Alignment error of /spl plusmn/1 /spl mu/m has been achieved.


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    Titel :

    Self-aligned assembly technology for laser diode modules using stripe-type AuSn solder bump flip-chip bonding


    Beteiligte:
    Sasaki, J. (Autor:in) / Honmou, H. (Autor:in) / Itoh, M. (Autor:in) / Uda, A. (Autor:in) / Torikai, T. (Autor:in)


    Erscheinungsdatum :

    01.01.1995


    Format / Umfang :

    258847 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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