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    Title :

    Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect


    Contributors:
    Choa, S. H. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 5 ; 677-686


    Publication date :

    2009-01-01


    Size :

    10 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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