Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect
MICROSYSTEM TECHNOLOGIES ; 15 , 5 ; 677-686
2009-01-01
10 pages
Article (Journal)
English
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
British Library Online Contents | 2004
|Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging
British Library Online Contents | 2015
|CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration
British Library Online Contents | 2012
|British Library Online Contents | 2014
|A study on effect of wafer bow in wafer-level BCB cap transfer packaging
British Library Online Contents | 2014
|