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    Title :

    CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration


    Contributors:
    Dragoi, V. (author) / Pabo, E. (author) / Burggraf, J. r. (author) / Mittendorfer, G. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 18 , 7/8 ; 1065-1075


    Publication date :

    2012-01-01


    Size :

    11 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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