Wafer-level plasma activated bonding: new technology for MEMS fabrication
MICROSYSTEM TECHNOLOGIES ; 14 , 4-5 ; 509-515
2008-01-01
7 pages
Article (Journal)
English
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Adhesive wafer bonding with photosensitive polymers for MEMS fabrication
British Library Online Contents | 2010
|CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration
British Library Online Contents | 2012
|Oxidized bridges technology for suspended MEMS fabrication using standard silicon wafer
British Library Online Contents | 2015
|Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle
British Library Online Contents | 2006
|Effect of interfacial SiO2 thickness for low temperature O2 plasma activated wafer bonding
British Library Online Contents | 2006
|