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    Title :

    Adhesive wafer bonding with photosensitive polymers for MEMS fabrication


    Contributors:
    Cakmak, E. (author) / Dragoi, V. (author) / Capsuto, E. (author) / McEwen, C. (author) / Pabo, E. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 16 , 5 ; 799-808


    Publication date :

    2010-01-01


    Size :

    10 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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