Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Wafer-bonding workshop for MEMS technologies (WBW-MEMS), 11–12 October 2004, Halle


    Contributors:
    Michel, B. (author) / Bagdahn, J. r. (author)

    Published in:

    Publication date :

    2006-01-01


    Size :

    377 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

    Dragoi, V. / Pabo, E. / Burggraf, J. r. et al. | British Library Online Contents | 2012


    Adhesive wafer bonding with photosensitive polymers for MEMS fabrication

    Cakmak, E. / Dragoi, V. / Capsuto, E. et al. | British Library Online Contents | 2010


    Wafer-level plasma activated bonding: new technology for MEMS fabrication

    Dragoi, V. / Mittendorfer, G. / Thanner, C. et al. | British Library Online Contents | 2008


    Capping technologies for MEMS

    Hausnear, R. / Stahl, H. | Tema Archive | 2010


    Advanced Technologies for Co-Packaging MEMS

    Lyke, J. / Aerospace Corporation | British Library Conference Proceedings | 1999