The current sensor portfolio at Bosch is covering a large variety of different MEMS-based sensor products. Today the market in automotive applications is very diversified, but in the meantime consumer products come more and more into focus of MEMS fabrication. Outstanding examples for automotive applications are pressure sensors for engine control, side impact detection, tire pressure monitoring and inertial sensors for airbag systems, navigation and vehicle-dynamics control (ESP). Since the start of production in 1993 more than 1 billion sensors were produced in Reutlingen. With new applications, e.g. in the consumer electronics or information technology, new constraints with regard to size and thickness of the sensor arise requiring new technologies in wafer-level packaging. Glass-frit and anodic bonding are well and long-term established standard technologies at Bosch used for hermetic packaging of MEMS on wafer-level. Both technologies require comparatively large chip sizes, glass-frit bonds due to the melting process, anodic bonds due to two-step chip dicing process. New concepts named advanced porous silicon membrane (APSM) for pressure sensors, micro packaging technology and thin film encapsulation for inertial sensors featuring MEMS key processes like DRIE for vias, wafer thinning, epipoly-silicon deposition enable smaller and thinner devices. Some key processes and examples will be described.


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    Title :

    Capping technologies for MEMS


    Contributors:
    Hausnear, R. (author) / Stahl, H. (author)


    Publication date :

    2010


    Size :

    5 Seiten, 8 Bilder, 2 Quellen



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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