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    Title :

    A study on effect of wafer bow in wafer-level BCB cap transfer packaging


    Contributors:
    Seok, S. (author) / Kim, J. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 20 , 2 ; 215-219


    Publication date :

    2014-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




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