High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging
MICROSYSTEM TECHNOLOGIES ; 10 ; 517-521
2004-01-01
5 pages
Article (Journal)
English
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect
British Library Online Contents | 2009
|Application of Aerosol Jet technology in through-via interconnection for MEMS wafer-level packaging
British Library Online Contents | 2015
|CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration
British Library Online Contents | 2012
|British Library Conference Proceedings | 2004
|