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    Title :

    High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging


    Contributors:
    Lin, C.-J. (author) / Lin, M.-T. (author) / Wu, S.-P. (author) / Tseng, F.-G. (author)

    Published in:

    Publication date :

    2004-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




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