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    Title :

    Wafer-Level Packaging of Optoelectronic Chips using Sea of Leads Electrical and Optical I/O Interconnections



    Conference:

    Annual Meeting; 17TH, IEEE Lasers & Electro-optics Society:; LEOS 2004 ; 2004 ; Rio Grande, Puerto Rico



    Publication date :

    2004-01-01


    Size :

    2 pages


    Remarks:

    IEEE cat. no. 04CH37581




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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