This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.


    Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections


    Contributors:
    Bakir, M.S. (author) / Meindl, J.D. (author)


    Publication date :

    2004-01-01


    Size :

    84151 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Wafer-Level Packaging of Optoelectronic Chips using Sea of Leads Electrical and Optical I/O Interconnections

    Lasers and Electro-optics Society (Institute of Electrical and Electronics Engineers) | British Library Conference Proceedings | 2004


    System demonstrator for board-to-board-level substrate-guided wave optoelectronic interconnections [4292-18]

    Han, X. / Kim, G. / Gupta, H. et al. | British Library Conference Proceedings | 2001


    Optoelectronic communication speedup on mesh processors using reduced cellular hypercube interconnections

    Lin, J.-F. / Sawchuk, A. A. | British Library Conference Proceedings | 1995


    Optoelectronic Packaging for Optical Interconnects

    Lee, S. H. / Lee, Y. C. | British Library Online Contents | 2006


    Optoelectronic Packaging

    Oman, H. | Online Contents | 1997