Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Direct bonding with on-wafer metal interconnections


    Contributors:
    Jia, C. (author) / Wiemer, M. (author) / Gessner, T. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 5 ; 391-396


    Publication date :

    2006-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Wafer direct bonding with ambient pressure plasma activation

    Gabriel, M. / Johnson, B. / Suss, R. et al. | British Library Online Contents | 2006


    Fabrication of Buried Corrugated Waveguides by Wafer-Direct Bonding

    Pelissier, S. / Pandraud, G. / Mure-Ravaud, A. et al. | British Library Online Contents | 2000


    High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging

    Lin, C.-J. / Lin, M.-T. / Wu, S.-P. et al. | British Library Online Contents | 2004


    Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks

    Brida, S. / Metivet, S. / Petit, D. et al. | British Library Online Contents | 2005


    Lightweight interconnections

    Lawrence, R.B. / Howell, T. | Tema Archive | 1986