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    Title :

    Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks


    Contributors:
    Brida, S. (author) / Metivet, S. (author) / Petit, D. (author) / Stojanovic, O. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 1-2 ; 59-62


    Publication date :

    2005-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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