Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks
MICROSYSTEM TECHNOLOGIES ; 12 , 1-2 ; 59-62
01.01.2005
4 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Laser wafer marking tracks IC production
British Library Online Contents | 1999
|Direct bonding with on-wafer metal interconnections
British Library Online Contents | 2006
|Wafer level encapsulation of microsystems using glass frit bonding
British Library Online Contents | 2006
|Silicon wafer transport device and silicon wafer transport vehicle
Europäisches Patentamt | 2024
|Enhanced Fiber Grating Coupler Integrated by Wafer-to-Wafer Bonding
British Library Online Contents | 2011
|