Wafer level encapsulation of microsystems using glass frit bonding
MICROSYSTEM TECHNOLOGIES ; 12 , 5 ; 468-472
01.01.2006
5 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Glass frit bonding: an universal technology for wafer level encapsulation and packaging
British Library Online Contents | 2005
|Temperature dependent fracture toughness of glass frit bonding layers
British Library Online Contents | 2010
|Mechanical properties of glass frit bonded micro packages
British Library Online Contents | 2006
|GLASS FRIT COMPOSITION AND GLASS ENAMEL COMPOSITION COMPRISING SAME FOR AUTOMOTIVE TEMPERED GLASS
Europäisches Patentamt | 2019
|Laser assisted glass frit sealing of dye-sensitized solar cells
Online Contents | 2012
|