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    Title :

    Wafer level encapsulation of microsystems using glass frit bonding


    Contributors:
    Knechtel, R. (author) / Wiemer, M. (author) / Frömel, J. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 5 ; 468-472


    Publication date :

    2006-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




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