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    Title :

    Glass frit bonding: an universal technology for wafer level encapsulation and packaging


    Contributors:

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 1-2 ; 63-68


    Publication date :

    2005-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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