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    Title :

    Metallic wafer and chip bonding for led packaging



    Conference:

    5th, Pacific Rim conference on lasers and electro-optics; photonics lights innovation: from nano-structures and devices to systems and networks ; 2003 ; Taipei, Taiwan



    Publication date :

    2003-01-01


    Size :

    26 pages


    Remarks:

    Includes bibliographic references and author index



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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