Metallic wafer and chip bonding for led packaging
5th, Pacific Rim conference on lasers and electro-optics; photonics lights innovation: from nano-structures and devices to systems and networks ; 2003 ; Taipei, Taiwan
2003-01-01
26 pages
Includes bibliographic references and author index
Conference paper
English
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Metallic wafer and chip bonding for LED packaging
IEEE | 2003
|Laser transmission bonding of silicon to silicon with metallic interlayers for wafer-level packaging
British Library Online Contents | 2013
|Glass frit bonding: an universal technology for wafer level encapsulation and packaging
British Library Online Contents | 2005
|British Library Online Contents | 2011
|Wafer bonding using Cu–Sn intermetallic bonding layers
British Library Online Contents | 2014
|