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    Title :

    A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging


    Contributors:
    Wang, Q. (author) / Yang, X. (author) / Zhang, Y. (author) / Ding, J. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 17 , 10-11 ; 1629-1633


    Publication date :

    2011-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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