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    Title :

    Flip chip electrical interconnection by selective electroplating and bonding


    Contributors:
    Pan, L.-W. (author) / Yuen, P. (author) / Lin, L. (author) / Garcia, E. J. (author)

    Published in:

    Publication date :

    2003-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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