Flip chip electrical interconnection by selective electroplating and bonding
MICROSYSTEM TECHNOLOGIES ; 10 ; 7-10
2003-01-01
4 pages
Article (Journal)
English
DDC: | 629.83 |
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
A flip-chip LIGA assembly technique via electroplating
British Library Online Contents | 2001
|Flip-chip bonding of high-speed laser diodes
IEEE | 1996
|Flip-Chip Bonding of High-Speed Laser Diodes
British Library Conference Proceedings | 1996
|Low-Temperature Direct Flip-Chip Bonding for Integrated Micro-Systems
British Library Conference Proceedings | 2005
|