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    Title :

    Low-Temperature Direct Flip-Chip Bonding for Integrated Micro-Systems



    Conference:

    18th:; ANNUAL MEETING, Lasers and Electro-Optics Society; IEEE LEOS ; 2005 ; Sydney, Australia



    Publication date :

    2005-01-01


    Size :

    2 pages


    Remarks:

    IEEE cat no: 05CH37693




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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