We propose a photo-diode module integrated with a pre-amplifier IC using a novel flip-chip bonding technique. An Au stud bump is used as a bonding material, and the waveguide photodiode is directly mounted on an InP hetero bipolar transistor IC.


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    Title :

    Microwave photo-diode module integrated with a preamplifier IC using a flip-chip bonding technique


    Contributors:
    Hatta, (author) / Miyahara, (author) / Okada, (author) / Ota, (author) / Noda, (author) / Kaneko, (author) / Itamoto, (author) / Sekimoto, (author) / Ishizaki, (author) / Ishimura, (author)


    Publication date :

    2002-01-01


    Size :

    201469 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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