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    Title :

    Inductance-Controlled Electroabsorption Modulator Modules Using the Flip-Chip Bonding Technique


    Contributors:
    Hatta, T. (author) / Miyahara, T. (author) / Ishizaki, M. (author) / Okada, N. (author) / Zaizen, S. (author) / Motoshima, K. (author) / Kasahara, K. (author)

    Published in:

    Publication date :

    2005-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    621.3692



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