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    Title :

    Reduction of Alignment Shift in Flip-Chip Bonding for VSCEL Array Module Packaging


    Contributors:

    Conference:

    Pacific Rim conference; 4th, Lasers and electro-optics; CLEO/Pacific Rim 2001 ; 2001 ; Chiba, Japan



    Publication date :

    2001-01-01


    Size :

    I-390-391


    Remarks:

    Held with InterOpto2001. IEEE cat no 01TH8557



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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