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    Title :

    Self-alignment by flip-chip bonding for OE-MCM packaging (Invited Paper) [2153-18]


    Contributors:

    Conference:

    Conference, Optoelectronic interconnects II ; 1994 ; Los Angeles; CA



    Publication date :

    1994-01-01


    Size :

    14 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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