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    Title :

    Flip chip packaging for MEMS microphones


    Contributors:
    Feiertag, G. (author) / Winter, M. (author) / Leidl, A. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 16 , 5 ; 817-823


    Publication date :

    2010-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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