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    Title :

    Parametric study of flip-chip packaging for an MEMS device with diaphragm


    Contributors:
    Chuang, C. H. (author) / Li, W. H. (author) / Lee, S. L. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 17 , 4 ; 669-675


    Publication date :

    2011-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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