We propose a photo-diode module integrated with a pre-amplifier IC using a novel flip-chip bonding technique. An Au stud bump is used as a bonding material, and the waveguide photodiode is directly mounted on an InP hetero bipolar transistor IC.
Microwave photo-diode module integrated with a preamplifier IC using a flip-chip bonding technique
01.01.2002
201469 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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