We propose a photo-diode module integrated with a pre-amplifier IC using a novel flip-chip bonding technique. An Au stud bump is used as a bonding material, and the waveguide photodiode is directly mounted on an InP hetero bipolar transistor IC.


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    Titel :

    Microwave photo-diode module integrated with a preamplifier IC using a flip-chip bonding technique


    Beteiligte:
    Hatta, (Autor:in) / Miyahara, (Autor:in) / Okada, (Autor:in) / Ota, (Autor:in) / Noda, (Autor:in) / Kaneko, (Autor:in) / Itamoto, (Autor:in) / Sekimoto, (Autor:in) / Ishizaki, (Autor:in) / Ishimura, (Autor:in)


    Erscheinungsdatum :

    01.01.2002


    Format / Umfang :

    201469 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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