An optimum approach for reduction of alignment shift in flip-chip bonding for vertical cavity surface emitting laser (VSCEL) array module package is presented. The laser array module was fabricated by the assembly of a 4-channel VSCEL array and 50/125 /spl mu/m multimode fiber ribbons. The results show that the alignment shifts of flip-chip bonding under the optimum process of 20 sec bonding time and 20 g loading are minimum. The average minimum misalignments of flip-chip bonding were measured to be 1 and 5 /spl mu/m for horizontal and vertical directions, respectively.


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    Titel :

    Reduction of alignment shift in flip-chip bonding for VSCEL array module packaging


    Beteiligte:
    Wu, J.W. (Autor:in) / Cheng, C.C. (Autor:in) / Yuang, R.H. (Autor:in) / Chu, M.T. (Autor:in) / Cheng, W.H. (Autor:in)


    Erscheinungsdatum :

    2001-01-01


    Format / Umfang :

    157674 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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