In summary, flip-chip provides a mounting scheme with excellent electrical and thermal properties for high-speed laser diodes. In addition, it is compatible with passive alignment to fibres, thus making it attractive for low-cost packaging of transmitter modules.
Flip-chip bonding of high-speed laser diodes
1996-01-01
214843 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Flip-Chip Bonding of High-Speed Laser Diodes
British Library Conference Proceedings | 1996
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British Library Conference Proceedings | 1998
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