Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    A flip-chip LIGA assembly technique via electroplating


    Contributors:
    Pan, L.-W. (author) / Lin, L. (author) / Ni, J. (author)

    Published in:

    Publication date :

    2001-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Flip chip electrical interconnection by selective electroplating and bonding

    Pan, L.-W. / Yuen, P. / Lin, L. et al. | British Library Online Contents | 2003


    Alternative resist adhesion and electroplating layers for LIGA process

    El-Kholi, A. / Bade, K. / Mohr, J. et al. | British Library Online Contents | 2000


    Chip-level integration of RF MEMS on-chip inductors using UV-LIGA technique

    Park, D. S. / Jeong, Y. / Lee, J. B. et al. | British Library Online Contents | 2008


    Flip-chip assembly for photonic circuits [5454-02]

    Worhoff, K. / Heideman, R. G. / Gilde, M. J. et al. | British Library Conference Proceedings | 2004


    Quick Prototyping of Flip Chip Assembly With Mems

    Irwin, R. S. / Zhang, W. / Harsh, K. F. et al. | British Library Conference Proceedings | 1998