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    Title :

    Wafer bonding using Cu–Sn intermetallic bonding layers


    Contributors:
    Flötgen, C. (author) / Pawlak, M. (author) / Pabo, E. (author) / Wiel, H. J. (author) / Hayes, G. R. (author) / Dragoi, V. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 20 , 4/5 ; 653-662


    Publication date :

    2014-01-01


    Size :

    10 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




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