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    Title :

    Wafer direct bonding with ambient pressure plasma activation


    Contributors:
    Gabriel, M. (author) / Johnson, B. (author) / Suss, R. (author) / Reiche, M. (author) / Eichler, M. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 5 ; 397-400


    Publication date :

    2006-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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