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    Title :

    Surface activation using remote plasma for silicon to quartz wafer bonding


    Contributors:
    Belford, R. E. (author) / Sood, S. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 3 ; 407-412


    Publication date :

    2009-01-01


    Size :

    6 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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