This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.


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    Titel :

    Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections


    Beteiligte:
    Bakir, M.S. (Autor:in) / Meindl, J.D. (Autor:in)


    Erscheinungsdatum :

    2004-01-01


    Format / Umfang :

    84151 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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