This paper describes sea of leads (SoL), its processing, its process integration with optoelectronic devices, and its optical, electrical, and mechanical characteristics.
Wafer-level packaging of optoelectronic chips using sea of leads electrical and optical I/O interconnections
2004-01-01
84151 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
British Library Conference Proceedings | 2004
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